Voion Printing Group (International) Co. Ltd at the Pack Expo International 2014 Chicago, Lakeside Lower Hall – 10225

Hayward, CA and Guangdong, China-September 11, 2014 — Voion Printing Group and V-Innovative will be participating at the Pack Expo International for the first time.  It will be held in Chicago, United States on 2th-5th November 2014, booth Lakeside Lower Hall – 10225.

“We are pleased to invite you to join us for this coming event, and we look forward to sharing ideas and learning the new technologies from different manufacturing experts in helping clients to create innovative packaging economically,” said Tiger Lee, President and Founder.

Media Contact: Mae Hung 
[email protected]


McCormick Place Parking Lot Map, http://www.mccormickplace.com/attendees/pdf/McPlace-parking–lots.pdf


View map of booth